PHONEFIX 0.12MM Thickness BGA Plant Tin Plate for iPhone 5 5S 6 6Plus 6S CPU NAND Flash Reballing Soldering Stencil Template Kit
Technical Details
Advantage: | Best BGA Repair Solution for Huawei Circuit Board |
Application: | phone repair tool |
Brand Name: | DIYPHONE |
Color: | As Pictures Shows |
Compatible: | for iPhone 5 5S 5C 6 6 PLUS 6S 6S Plus |
design: | for iPhone Reballing Tin Steel Net Set |
DIY Supplies: | Electrical |
Drop ship: | Support |
Features: | Ultra-thin Steel Sheet, Durable |
Function: | Phone Plant Tin Plate Net Kit for Rework Station |
item name: | Plant Tin Stencil Templates for iPhone |
Material: | Stainless Steel Net |
Model Number: | UD WIFI IC / Touch IC/ NAND Flash Reballing |
Package: | Box |
Size: | 0.12mm |
Suitable for: | CPU, Font, Audio, Power IC Plant Tin Steel Net |
Supplier: | DIYPHONE |
Thickness: | 0.12mm |
Type: | Phone Repair tool |
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