PHONEFIX 0.12MM Thickness BGA Plant Tin Plate for iPhone 5 5S 6 6Plus 6S CPU NAND Flash Reballing Soldering Stencil Template Kit
Technical Details
| Advantage: | Best BGA Repair Solution for Huawei Circuit Board |
| Application: | phone repair tool |
| Brand Name: | DIYPHONE |
| Color: | As Pictures Shows |
| Compatible: | for iPhone 5 5S 5C 6 6 PLUS 6S 6S Plus |
| design: | for iPhone Reballing Tin Steel Net Set |
| DIY Supplies: | Electrical |
| Drop ship: | Support |
| Features: | Ultra-thin Steel Sheet, Durable |
| Function: | Phone Plant Tin Plate Net Kit for Rework Station |
| item name: | Plant Tin Stencil Templates for iPhone |
| Material: | Stainless Steel Net |
| Model Number: | UD WIFI IC / Touch IC/ NAND Flash Reballing |
| Package: | Box |
| Size: | 0.12mm |
| Suitable for: | CPU, Font, Audio, Power IC Plant Tin Steel Net |
| Supplier: | DIYPHONE |
| Thickness: | 0.12mm |
| Type: | Phone Repair tool |
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