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MaAnt C1 Magnetic QSD CPU BGA Universal Reballing Stencil For Qualcomm Snapdragon 865 870 888 845 855 765G 778G Phone Steel Mesh
sku: 1005004824946509
$2.16
83.50 грн.
+5%
~
88.00 грн.
$2.16, $1.00 = 40.65 грн.
200.00 руб.
-5%
~
190.00 руб.
$2.16, $1.00 = 88.09 руб.
€ 2.04
-1%
~
€ 2.02
$2.16, € 1.00 = $1.08
Shipping from: China
the store does not ship to your country
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$2.16
MaAnt C1 Magnetic QSD CPU BGA Universal Reballing Stencil For Qualcomm Snapdragon 865 870 888 845 855 765G 778G Phone Steel Mesh
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MaAnt C1 Magnetic QSD CPU Snapdragon 865 870 888 845 855 765G 778G For Samsung ViVo OPPO CPU BGA Universal Reballing Stencil
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AMAOE BS1 BS2 BGA Reballing Stencil for Snapdragon 865/870/888 SM8250/8350 CPU Universal Planting Tin Steel Mesh
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AMAOE BS1 BS2 BGA Reballing Stencil for Snapdragon 865/870/888 SM8250/8350 CPU Planting Tin Steel Mesh
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BGA Reball Stencil for Qualcomm MSM SDM CPU RAM 710/778G 720G 835/765G/662/750G/695/820/775G/888/865/870/8+Gen1/8 Gen2/765G/845
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Amaoe BGA Reballing Stencil QU8 For SM8250/SDM439/SM8350/Qualcomm Snapdragon 888/CPU Steel Mesh
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31%
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AMAOE BGA Reballing Stencil for Qualcomm Snapdragon CPU 888/870/8Gen2/680/765G/775G/SM7250/SM7350/SM8350/SM8450/SM7325/MSM8898
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$2.23
Amaoe QU8 BGA Reballing Stencil For SM8350 SDM439 SM8250 102/002 For Qualcomm Snapdragon 888 CPU RAM BGA Direct Heat Template
16%
$3.00
AMAOE BS1-2 BGA Reballing Stencil For Xiaomi Black Shark 1 2 3 3S 4 4S Pro Helo 888 870 865 855 SM8350 SM8250 SM8150 SDM845 CPU
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Amaoe HW16 BGA Reballing Stencil For Huawei Honor 50 50Pro Qualcomm Snapdragon 778G SM7325 CPU Planting Tin Net Repair Tools
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AMAOE BS1-2 BGA Reballing Stencil For Xiaomi Black Shark 1 2 3 3S 4 4S Pro Helo 888 870 865 855 SM8350 SM8250 SM8150 SDM845 CPU
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Amaoe BGA reballing stencil For REDMI K20 K20Pro XIAOMI 9 Qualcomm Snapdragon 730 sm7150 855 SM8150 CPU Chip BGA Tin Plant Net
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Amaoe MQ1-4 BGA Reballing Stencil for Qualcomm 888/778G/8 Gen1/865/SDM845/8250/7250 MTK 800 900 MT6799W MT6877V CPU RAM IC Chip
-1%
2%
$2.97
Amaoe MQ1-4 BGA Reballing Stencil for Qualcomm 888/778G/8 Gen1/865/SDM845/8250/7250 MTK 800 900 MT6799W MT6877V CPU RAM IC Chip
1%
$2.00
Amaoe BS1 BGA Reballing Stencil for Black Shark 3 3Pro 3S 4 4Pro 4S Snapdragon 865 870 888 SM8250 8350 Tin Planting Net 0.12MM
1%
$3.13
Amaoe MQ1-4 BGA Reballing Stencil for Qualcomm 888/778G/8 Gen1/865/SDM845/8250/7250 MTK Tiji 800 900 MT6799W MT6877V CPU RAM IC
1%
$3.34
AMAOE BS1 BS2 BGA Reballing Stencil For Xiaomi Black Shark 1 2 3 3S 4 4S Pro Helo for Snapdragon 865/870/888 SM8250/8350 Net
+8%
1%
$5.70
Amaoe BS1 BGA Reballing Stencil for Black Shark 3 3Pro 3S 4 4Pro 4S Snapdragon 865 870 888 SM8250 8350 Tin Planting Net 0.12MM
1%
$2.61
AMAOE BGA Reballing Stencil for Qualcomm Snapdragon 855/730/845 SM8150 SM7150 SDM845 BGA245 Direct heating BGA Template
-6%
1%
$2.61
AMAOE BGA Reballing Stencil for Qualcomm Snapdragon 865/870 SM8250 Direct heating Square hole BGA Stencil Thickness 0.12mm
1%
$2.26
AMAOE BGA stencil for Qualcomm Snapdragon 888/870/865/SM8350/SM8450/SM8550/SM8475/SM8425/SM8250 Direct heating square hole
+7%
1%
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Amaoe BS2 BGA Reballing Stencil for Snapdragon 855 845 SM845 SM8150 Black Shark 1 2 2Pro Helo 0.12MM Tin Plant Net
+1%
1%
$3.54
Amaoe BS1 BGA Reballing Stencil for Black Shark 3 3Pro 3S 4 4Pro 4S Snapdragon 865 870 888 SM8250 8350 Tin Planting Net 0.12MM
1%
$3.60
BS1 BS2 BGA reballing Stencil for Blackshark 1/2Pro/Helo 3Pro/4SPro 865/870/SM8250/8350/ 855/845/SM845/8150 CPU RAM PM8350 PM825
1%
$3.53
Amaoe BS1 BGA Reballing Stencil for Black Shark 3 3Pro 3S 4 4Pro 4S Snapdragon 865 870 888 SM8250 8350 Tin Planting Net 0.12MM
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0.037, 10.16
7/.015,514 0=.000,063 1=.000,794/1 2=.000,745/1 3=.000,402/1 4=.000,905/1 5=.004,680/1 6=.000,110/1 7=.007,878/36
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