MECHANIC Thickened 3D BGA Reballing Stencil for iPhone XR XS X 8 7 6 S iPad All Series Hard Disk NAND PCIE Planting Tin Template

MECHANIC Thickened 3D BGA Reballing Stencil for iPhone XR XS X 8 7 6 S iPad All Series Hard Disk NAND PCIE Planting Tin Template
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sku: 33013473611
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$4.98
Shipping from: China
   Technical Details
gmtCreate: 1557730800
Model Number: 3D BGA Stencil
Package: 1 Positioning Slot + 2 Soldering Net
Package Size: 12cm x 5cm x 5cm (4.72in x 1.97in x 1.97in)
Package Weight: 0.1kg (0.22lb.)
Particle Size: 1-10μm
Unit Type: piece
Usage: Repair Tools for iPhone X
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