MECHANIC 4D BGA Reballing Stencil for Phone 11 11Pro Pro Max X XS XSMAX Motherboard Tin Leak-proof Middle Layer Planting Tin

MECHANIC 4D BGA Reballing Stencil for Phone 11 11Pro Pro Max X XS XSMAX Motherboard Tin Leak-proof Middle Layer Planting Tin
thumb
thumb
thumb
thumb
thumb
thumb
sku: 4000423264660
$15.40-12%
$13.59
Shipping from: China
   Price history chart & currency exchange rate

Customers also viewed