MECHANIC 4D-11 PRO For iPhone 11/11 Pro/11 Pro Max X XS XSMAX 3D 4D BGA Reballing Stencil Motherboard Middle Layer Planting Tin
sku: 4000387241198
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$7.33
Shipping from: China
Technical Details
| Application: | BGA Reballing Stencil |
| Brand Name: | wozniak |
| D-11PRO: | For iPhone 11 11PRO PROMAX |
| DIY Supplies: | Metalworking |
| D-X: | For iPhone X |
| D-XSM: | For iPhone XS XS MAX |
| Feature: | 4D leakproof tin |
| Function: | Used to repair motherboard IC chip |
| Gold: | square hole chamfer |
| Model Number: | 4D-11 PRO |
| Package: | Bag |
| Size: | 100*80*0.12mm |
| Type: | Steel Mesh |
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