MDM9645 BGA Stencil For iPhone 7 7Plus For Qualcomm Baseband CPU IC Reball Solder Tin Plant Heat Template 0.10mm Thickness

MDM9645 BGA Stencil For iPhone 7 7Plus For Qualcomm Baseband CPU IC Reball Solder Tin Plant Heat Template 0.10mm Thickness
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sku: 1005002086260746
$4.80
Shipping from: China
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