BGA Reballing Stencil For iPhone 5S upper layer Bottom layer CPU IC Reball Solder Tin Plant Heat Template 0.10mm Thickness

BGA Reballing Stencil For iPhone 5S upper layer Bottom layer CPU IC Reball Solder Tin Plant Heat Template 0.10mm Thickness
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sku: 1005002458697082
$3.18
Shipping from: China
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