For iPhone 6 6P BGA Reballing Stencil upper layer Bottom layer CPU IC Reball Solder Tin Plant Heat Template 0.10 0.12 0.15 0.18

For iPhone 6 6P BGA Reballing Stencil upper layer Bottom layer CPU IC Reball Solder Tin Plant Heat Template 0.10 0.12 0.15 0.18
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sku: 1005002458216440
$3.18
Shipping from: China
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