For iPhone 11 11PRO 11PROMAX BGA Reballing Stencil Upper Layer Bottom layer CPU IC Reball Solder Tin Plant Heat Template

For iPhone 11 11PRO 11PROMAX BGA Reballing Stencil Upper Layer Bottom layer CPU IC Reball Solder Tin Plant Heat Template
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sku: 1005003142514171
$3.18
Shipping from: China
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