For LG V30 V30P V30S V30S+ H930DS BGA Stencil MSM8998 CPU IC Reball Pin Tin Plant Net Solder Heat Template Anti Drum-up 0.12mm

For LG V30 V30P V30S V30S+ H930DS BGA Stencil MSM8998 CPU IC Reball Pin Tin Plant Net Solder Heat Template Anti Drum-up 0.12mm
sku: 32963023672
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$7.54
Shipping from: China
   Technical Details
Brand Name: NoEnName_Null
Model Number: LG3
Particle Size: 5-15μm
   Price history chart & currency exchange rate

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