IC Chip BGA Reballing Stencil Kit Solder Template for LG V30 V30+ V30S V30S+ H930DS MSM8998 CPU Tin Planting Net

IC Chip BGA Reballing Stencil Kit Solder Template for LG V30 V30+ V30S V30S+ H930DS MSM8998 CPU Tin Planting Net
sku: 4000280111439
$6.49
Shipping from: China
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IC Chip BGA Reballing Stencil Kit Solder Template for LG V30 V30+ V30S V30S+ H930DS MSM8998 CPU Tin Planting Net
99%
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IC Chip BGA Reballing Stencil Kit Solder Template for LG V30 V30+ V30S V30S+ H930DS MSM8998 CPU Tin Planting Net
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AMAOE LG3 BGA Reballing Stencil for LG V30 V30+ V30S+ H930DS MSM8998 IC Chip CPU Tin Plant Net Steel Mesh 0.12mm Thickness
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For LG V30 V30P V30S V30S+ H930DS BGA Stencil MSM8998 CPU IC Reball Pin Tin Plant Net Solder Heat Template Anti Drum-up 0.12mm
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30%
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26%
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24%
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Amaoe LG3 BGA Reballing Stencil Template for LG V30/V30P/V30S +/H930DS MSM8998 RAM CPU PMIC POWER AUDIO WIFI IC CHIP TIN
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-7%
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20%
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