BGA221 153 169 254 162 186 BGA Stencil eMMC EMCP Reballing IC Chip Pins Solder BGA Tin Plant Net Direct Heating Template G1139

BGA221 153 169 254 162 186 BGA Stencil eMMC EMCP Reballing IC Chip Pins Solder BGA Tin Plant Net Direct Heating Template G1139
sku: 32879595354
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$5.80
Shipping from: China
   Technical Details
Model Number: G1139
Particle Size: 25-48μm
   Price history chart & currency exchange rate

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