For eMMC EMCP BGA221 153 169 254 162 186 BGA Stencil Reballing Pins BGA Direct Heating Template 0.15mm Thickness Anti Drum-up
sku: 32894168182
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$3.99
Shipping from: China
Technical Details
Brand Name: | HONGPU |
Compatible Brand: | Apple iPhones |
Model Number: | FOR BGA NAND STENCIL |
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