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BGA Reballing Stencil Kit for Qualcomm Snapdragon 888/SM8350 Direct heating BGA Template Tin planting platform
sku: 1005005554476823
$10.50
+8%
$11.39
412.00 грн.
+14%
~
470.00 грн.
$11.39, $1.00 = 41.28 грн.
955.00 руб.
+9%
~
1,040.00 руб.
$11.39, $1.00 = 91.30 руб.
€ 9.70
+5%
~
€ 10.20
$11.39, € 1.00 = $1.12
Shipping from: China
the store does not ship to your country
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0.053, 11.54
7/.013,439 0=.000,083 1=.000,666/1 2=.000,612/1 3=.000,441/1 4=.000,427/1 5=.005,430/1 6=.000,157/1 7=.005,706/36
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