BGA Reballing Stencil Kit for Mobile phone EMMC EMCP UFS BGA153 BGA162 BGA221 BGA254 Tin planting platform Direct heating

BGA Reballing Stencil Kit for Mobile phone EMMC EMCP UFS BGA153 BGA162 BGA221 BGA254 Tin planting platform Direct heating
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sku: 1005005140825109
$7.34
Shipping from: China
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