AMAOE BGA Reballing Stencil for mobile phone EMMC CMCP UFS Chips BGA153 BGA169 BGA162 BGA186 BGA221 BGA254 Tin planting platform

AMAOE BGA Reballing Stencil for mobile phone EMMC CMCP UFS Chips BGA153 BGA169 BGA162 BGA186 BGA221 BGA254 Tin planting platform
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sku: 1005006228195460
$7.90+2%
$8.07
Shipping from: China
   Price history chart & currency exchange rate

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