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Amaoe U10 U11 Magnetic BGA Reballing Stencil Platform for SM8250 CPU Lower Layer RAM Upper Layer 0.12MM Solder Tin Planting Net
sku: 1005006447479780
$6.28
~
261.00 грн.
$6.28, $1.00 = 41.60 грн.
605.00 руб.
+1%
~
610.00 руб.
$6.28, $1.00 = 97.31 руб.
€ 5.85
+3%
~
€ 6.00
$6.28, € 1.00 = $1.04
Shipping from: China
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Amaoe U10 Magnetic BGA Reballing Stencil Platform for SM8250 CPU Lower Layer RAM Upper Layer 0.12MM Solder Tin Planting Net
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U10 U11 BGA Reballing Stencil Location plate Board for SM8250 CPU Lower Layer RAM Upper Layer Amaoe
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Amaoe QU1-8 BGA Reballing Stencil Kits Set for SM8250/SDM439/SM8350/Qualcomm888/CPU Tin Planting Template Heat Solder Direct Net
20%
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Amaoe QU1-8 BGA Reballing Stencil Kits Set for SM8250/SDM439/SM8350/Qualcomm888/CPU Tin Planting Template Heat Solder Direct Net
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AMAOE MSM8996 BGA Reballing Stencil For Upper and Lower Layer CPU High Temperature Resistance Tin Planting Steel Mesh IC Solder
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AMAOE MSM8992 BGA Reballing Stencil For Upper and Lower Layer CPU High Temperature Resistance Tin Planting Steel Mesh IC Solder
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AMAOE MSM8994 BGA Reballing Stencil For Upper and Lower Layer CPU High Temperature Resistance Tin Planting Steel Mesh IC Solder
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AMAOE SM8475 BGA Reballing Stencil For SM8250 SM8350 SM8450 RAM Steel Mesh IC Tin Planting Steel Mesh Chip Solder Template
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