Amaoe A7 BGA Reballing Stencil for Phone 5 5S Upper Layer and Lower Layer Magnetic Platform CPU IC Chip Tin Planting Solder Net

Amaoe A7 BGA Reballing Stencil for Phone 5 5S Upper Layer and Lower Layer Magnetic Platform CPU IC Chip Tin Planting Solder Net
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sku: 1005005719294319
$7.00
Shipping from: China
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