Amaoe Middle Layer BGA Reballing Stencil for Huawei P30Pro CPU IC Chip Tin Planting Soldering Net 0.1MM thickness

Amaoe Middle Layer BGA Reballing Stencil for Huawei P30Pro CPU IC Chip Tin Planting Soldering Net 0.1MM thickness
sku: 1005003670421698
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$9.00
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