Amaoe Middle Layer BGA Reballing Stencil for Huawei Mate30Pro 4G CPU IC Chip Tin Planting Soldering Net 0.1MM thickness

Amaoe Middle Layer BGA Reballing Stencil for Huawei Mate30Pro 4G CPU IC Chip Tin Planting Soldering Net 0.1MM thickness
sku: 1005003670420154
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$3.89
Shipping from: China
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