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Amaoe MBGA-B5 BGA Reballing Set Android Phone CPU Planting Tin Platform Glue Removal Positioning Board Heat Template Steel Mesh
sku: 1005005552831673
$6.48
251.00 грн.
+7%
~
268.00 грн.
$6.48, $1.00 = 41.40 грн.
585.00 руб.
-3%
~
565.00 руб.
$6.48, $1.00 = 87.54 руб.
€ 6.00
-1%
~
€ 5.95
$6.48, € 1.00 = $1.09
Shipping from: China
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Amaoe Mbga-B6 BGA reballing Stencil Template for Android Mobile Phone CPU Tin Planting Glue Removal Positioning Plate Steel Mesh
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Amaoe Mbga-B7 BGA Reballing Platform for Android CPU Tin Planting Glue Removal Positioning Board Steel Mesh
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Amaoe Mbga-B8 BGA Reballing Stencil Platform For Android Phone CPU Planting Tin Glue Removal Positioning Board Template Fixture
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