Amaoe Mbga-14 BGA Reballing Platform for Android Exynos U33-U38 CPU Tin Planting IC Glue Remove Positioning Plate With Stencil

Amaoe Mbga-14 BGA Reballing Platform for Android Exynos U33-U38 CPU Tin Planting IC Glue Remove Positioning Plate With Stencil
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sku: 1005003786214033
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$2.61
Shipping from: China
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