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Amaoe IC Chip BGA Reballing Stencil Platform For iPhone 6-X Qualcomm Baseband CPU Tin Planting Template Fixture
sku: 1005005403995315
$14.80
575.00 грн.
+7%
~
615.00 грн.
$14.80, $1.00 = 41.40 грн.
1,350.00 руб.
-4%
~
1,290.00 руб.
$14.80, $1.00 = 87.49 руб.
€ 13.80
-1%
~
€ 13.70
$14.80, € 1.00 = $1.08
Shipping from: China
the store does not ship to your country
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Amaoe BGA Reballing Stencil Platform Fixture For iPhone X/XS/11 Pro Max Qualcomm Baseband CPU Planting Tin Template Steel Mesh
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Amaoe High Quality BGA Reballing Stencil for iPhone 8/8p/x Qualcomm Baseband CPU IC Chip Tin Planting Soldering Net
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Amaoe High Quality BGA Reballing Stencil for iPhone 8/8p/x Qualcomm Baseband CPU IC Chip Tin Planting Soldering Net
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AMAOE 6-X Qualcomm Baseband Tin Planting Platform Set for Phone 6/6P/6S/6SP/7/7P/8/8P/X 0.10mm BGA Reballing Stencil Kit
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16%
$6.98
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6%
$6.99
Amaoe QU6 BGA Reballing Stencil For MDM6600 MDM9600 QSC6270 Qualcomm CPU With Baseband 0.12mm Chip IC Repair Steel Mesh
5%
$5.66
Amaoe BGA Reballing Stencil For Android Qualcomm Baseband CPU SM8350 SDM888 MSM8998 RAM Series Tin Planting Repair
4%
$7.82
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1%
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1%
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+1%
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~
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0.043, 7.44
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