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AMAOE MI11 BGA reballing Solder template stencil for Xiaomi CC9e REDMI note8 SM6125 /SDM710/CPU PM670 PM6125 BGA254
sku: 1005006285140493
$2.32
95.50 грн.
+1%
~
96.50 грн.
$2.32, $1.00 = 41.60 грн.
223.00 руб.
-7%
~
208.00 руб.
$2.32, $1.00 = 89.59 руб.
€ 2.16
+3%
~
€ 2.22
$2.32, € 1.00 = $1.05
Shipping from: China
the store does not ship to your country
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AMAOE BGA reballing Solder template stencil for Xiaomi CC9e REDMI note8 SM6125 /SDM710/CPU PM670 PM6125 BGA254
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AMAOE BGA reballing Solder template stencil for Xiaomi CC9e REDMI note8 SM6125 /SDM710/CPU PM670 PM6125 BGA254
80%
$5.80
AMAOE BGA reballing Solder template stencil for Xiaomi CC9e REDMI note8 SM6125 /SDM710/CPU PM670 PM6125 BGA254
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$3.30
AMAOE BGA reballing Solder template stencil for Xiaomi CC9e REDMI note8 SM6125 /SDM710/CPU PM670 PM6125 BGA254
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$4.80
AMAOE BGA reballing Solder template stencil for Xiaomi CC9e REDMI note8 SM6125 /SDM710/CPU PM670 PM6125 BGA254
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Amaoe MI11 BGA Reballing Stencil for Xiaomi CC9e Redmi note8 SM6125 SDM710 Solder BGA Heating Template CPU Tin Plant Net
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Amaoe MI11 BGA Reballing Stencil for Xiaomi CC9e Redmi note8 SM6125 SDM710 Solder BGA Heating Template CPU Tin Plant Net
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MI11 High quanlity BGA reballing Solder template stencil for CC9e note8 SM6125/SDM710/CPU PM670 PM6125 BGA254
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MI11 BGA Reballing Stencil Template For Xiaomi CC9 CC9E 8SE A3 For Redmi Note 8 Pro 8Pro CPU RAM PMI632 PM6125 SM6125 SDM710 IC
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Wylie WL-71 BGA Reballing Stencil For Xiaomi CC9 CC9e 8SE A3 Redmi Note8 SDM665 SM6125/SDM710 BGA254 CPU RAM Power WiFi IC Chip
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Wylie WL-71 BGA Reballing Stencil For Xiaomi CC9 CC9e 8SE A3 Redmi Note8 SDM665 SM6125/SDM710 BGA254 CPU RAM Power WiFi IC Chip
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SDR660 PM670A PM6125 PM670 PM7150 PM6150LPMI632 SM6125 SM6150 SM7150 SDM710 For oppo BGA Reballing Stencil Tin Solder Template
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Wylie WL-71 BGA Reballing Stencil For Xiaomi CC9 CC9e 8SE A3 Redmi Note8 SDM665 SM6125/SDM710 BGA254 CPU RAM Power WiFi IC Chip
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Amaoe Mi11 BGA Reballing Stencil for SM6125 SDM710 Xiaomi CC9 CC9E 8SE A3 Redmi Note 8 Pro CPU RAM POWER WIFI AUDIO IC Chip Mesh
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MI11 BGA Reballing Stencil Template For Xiaomi CC9 CC9e 8SE A3 For Redmi Note 8 Pro 8Pro CPU RAM SDR660 PMI632 PM6125 PM670 IC
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$2.80
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28%
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MI11 BGA Reballing Stencil For Xiaomi CC9 CC9e 8SE A3 Redmi Note 8 Pro 8Pro CPU RAM SM6125 SDM710 MT6785V SDR660 PMI632 MT6359
25%
$4.64
Amaoe Mi11 BGA Reballing Stencil for SM6125 SDM710 Xiaomi CC9 CC9E 8SE A3 Redmi Note 8 Pro CPU RAM POWER WIFI AUDIO IC Chip Mesh
24%
$2.69
Wylie WL-71 BGA Reballing Stencil For Xiaomi CC9 CC9e 8SE A3 Redmi Note8 SDM665 SM6125/SDM710 BGA254 CPU RAM Power WiFi IC Chip
17%
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MI11 BGA Reballing Stencil For Xiaomi CC9 CC9e 8SE A3 Redmi Note 8 Pro 8Pro CPU RAM SM6125 SDM710 MT6785V SDR660 PMI632 MT6359
14%
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SDR660 PM670A PM6125 PM670 PM7150 PM6150LPMI632 SM6125 SM6150 SM7150 SDM710 For oppo BGA Reballing Stencil Tin Solder Template
8%
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MI11 BGA Reballing Stencil For Xiaomi CC9 CC9e 8SE A3 Redmi Note 8 Pro 8Pro CPU RAM SM6125 SDM710 MT6785V SDR660 PMI632 MT6359
3%
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SDR660 PM670A PM6125 PM670 PM7150 PM6150LPMI632 SM6125 SM6150 SM7150 SDM710 For oppo BGA Reballing Stencil Tin Solder Template
1%
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SDR660 PM670A PM6125 PM670 PM7150 PM6150LPMI632 SM6125 SM6150 SM7150 SDM710 For oppo BGA Reballing Stencil Tin Solder Template
1%
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High Quality Amaoe BGA Reballing Stencil for CC9/CC9E/8SE/A3 HONGMI NOTE8 SM6125 PM670 WCN3950 Stencil
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0.032, 3.36
7/.009,025 0=.000,085 1=.000,727/1 2=.000,526/1 3=.000,532/1 4=.001,239/1 5=.001,944/1 6=.000,098/1 7=.003,959/36
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