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MI11 BGA Reballing Stencil Template For Xiaomi CC9 CC9e 8SE A3 For Redmi Note 8 Pro 8Pro CPU RAM SDR660 PMI632 PM6125 PM670 IC
sku: 1005004330162840
$3.98
161.00 грн.
+5%
~
169.00 грн.
$3.98, $1.00 = 42.45 грн.
372.00 руб.
+15%
~
428.00 руб.
$3.98, $1.00 = 107.56 руб.
€ 3.70
+4%
~
€ 3.86
$3.98, € 1.00 = $1.03
Shipping from: China
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MI11 BGA Reballing Stencil For Xiaomi CC9 CC9e 8SE A3 Redmi Note 8 Pro 8Pro CPU RAM SM6125 SDM710 MT6785V SDR660 PMI632 MT6359
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MI11 BGA Reballing Stencil For Xiaomi CC9 CC9e 8SE A3 Redmi Note 8 Pro 8Pro CPU RAM SM6125 SDM710 MT6785V SDR660 PMI632 MT6359
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Wylie WL-71 BGA Reballing Stencil For Xiaomi CC9/CC9e/8SE/A3/Redmi Note 8 BGA254 SDM665 SM6125/SDM710 CPU RAM Power WiFi IC Chip
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MI11 BGA Reballing Stencil For Xiaomi CC9 CC9e 8SE A3 Redmi Note 8 Pro 8Pro CPU RAM SM6125 SDM710 MT6785V SDR660 PMI632 MT6359
+21%
43%
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Amaoe Mi11 BGA Reballing Stencil for SM6125 SDM710 Xiaomi CC9 CC9E 8SE A3 Redmi Note 8 Pro CPU RAM POWER WIFI AUDIO IC Chip Mesh
41%
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Wylie WL-71 BGA Reballing Stencil For Xiaomi CC9/CC9e/8SE/A3/Redmi Note8 SDM665 SM6125/SDM710 BGA254 CPU RAM Power WiFi IC Chip
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40%
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Wylie WL-71 BGA Reballing Stencil For Xiaomi CC9 CC9e 8SE A3 Redmi Note8 SDM665 SM6125/SDM710 BGA254 CPU RAM Power WiFi IC Chip
38%
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Wylie WL-71 BGA Reballing Stencil For Xiaomi CC9 CC9e 8SE A3 Redmi Note8 SDM665 SM6125/SDM710 BGA254 CPU RAM Power WiFi IC Chip
35%
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Wylie WL-71 BGA Reballing Stencil For Xiaomi CC9 CC9e 8SE A3 Redmi Note8 SDM665 SM6125/SDM710 BGA254 CPU RAM Power WiFi IC Chip
32%
$2.80
Wylie WL-71 BGA Reballing Stencil For Xiaomi CC9/CC9e/8SE/A3/Redmi Note8 SDM665 SM6125/SDM710 BGA254 CPU RAM Power WiFi IC Chip
30%
$2.80
Wylie WL-71 BGA Reballing Stencil For Xiaomi CC9 CC9e 8SE A3 Redmi Note8 SDM665 SM6125/SDM710 BGA254 CPU RAM Power WiFi IC Chip
29%
$4.18
AMAOE Stencil MI:11 For Xiaomi CC9 8SE A3 Redmi Note8 CPU Reballing Stencil IC PMI632 PM6125 MT6360P PM670 MT6359VKP MT6186MV
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AMAOE MI11 BGA reballing Solder template stencil for Xiaomi CC9e REDMI note8 SM6125 /SDM710/CPU PM670 PM6125 BGA254
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For xiaomi CC9/CC9e/8SE/A3 Redmi NOTE8 8PRO SM6125 665 710 SDM710 IC Chip BGA Reballing Stencil Solder BGA Heating Template
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1%
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Amaoe BGA reballing stencil For XIAOMI CC9 CC9e 8se A3 Redmi note8 Qualcomm Snapdragon 655 SM6125 710 SDM710 CPU Tin Plant Net
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MI11 High quanlity BGA reballing Solder template stencil for CC9e note8 SM6125/SDM710/CPU PM670 PM6125 BGA254
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High Quality Amaoe BGA Reballing Stencil for CC9/CC9E/8SE/A3 HONGMI NOTE8 SM6125 PM670 WCN3950 Stencil
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SDR660 PM670A PM6125 PM670 PM7150 PM6150LPMI632 SM6125 SM6150 SM7150 SDM710 For oppo BGA Reballing Stencil Tin Solder Template
-20%
1%
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SDR660 PM670A PM6125 PM670 PM7150 PM6150LPMI632 SM6125 SM6150 SM7150 SDM710 For oppo BGA Reballing Stencil Tin Solder Template
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SDR660 PM670A PM6125 PM670 PM7150 PM6150LPMI632 SM6125 SM6150 SM7150 SDM710 For oppo BGA Reballing Stencil Tin Solder Template
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0.035, 1.54
7/.012,456 0=.000,068 1=.000,772/1 2=.000,585/1 3=.000,408/1 4=.000,899/1 5=.005,030/1 6=.000,092/1 7=.004,670/36
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