A8 A9 A10 CPU BGA Stencil For iPhone 6 6S 7 7P Bottom Layer IC Reballing Chip Pin Solder Tin Plant Net Steel Mesh Amaoe MBGA-U1

A8 A9 A10 CPU BGA Stencil For iPhone 6 6S 7 7P Bottom Layer IC Reballing Chip Pin Solder Tin Plant Net Steel Mesh Amaoe MBGA-U1
sku: 1005002589681015
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$7.25
Shipping from: China
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