A8 A9 A10 CPU IC BGA Stencil For iPhone 6 6Plus 6S 6SP 7 7P Bottom Layer Chip Reballing Solder Tin Plant Net Amaoe MBGA-U1

A8 A9 A10 CPU IC BGA Stencil For iPhone 6 6Plus 6S 6SP 7 7P Bottom Layer Chip Reballing Solder Tin Plant Net Amaoe MBGA-U1
sku: 1005002247963096
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$7.25
Shipping from: China
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