25000pcs/bottle 0.2-0.65mm BGA Reballing Balls Leaded For IC Chip Soldering Accessories Solder Ball Tin Material Sn63/Pb37 Rewor

25000pcs/bottle 0.2-0.65mm BGA Reballing Balls Leaded For IC Chip Soldering Accessories Solder Ball Tin Material Sn63/Pb37 Rewor
sku: 4000182612019
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$1.76
Shipping from: China
   Technical Details
Balls League: Sn63 / Pb37
Date: 09-17
Feature: Rework Repair Tools
Model Number: Solder Ball
Particle Size: 1-10μm
quantity: 25,000 PCS per Bottle
Standard: RoHs Available & SGS Tested
   Price history chart & currency exchange rate

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