0.2-0.65mm 25000pcs/bottle BGA Reballing Balls Leaded For IC Chip Soldering Accessories Solder Ball Tin Material Sn63/Pb37 Rewor

0.2-0.65mm 25000pcs/bottle BGA Reballing Balls Leaded For IC Chip Soldering Accessories Solder Ball Tin Material Sn63/Pb37 Rewor
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sku: 4000141397299
$1.60
Shipping from: China
   Technical Details
Balls League: Sn63 / Pb37
Date: 9-2
Model Number: Solder Ball
Particle Size: 1-10μm
quantity: 25,000 PCS per Bottle
Size: 0.25mm,0.3mm,0.35mm,0.4mm,0.45mm,0.5mm,0.55mm,0.6mm,0.65mm
Standard: RoHs Available & SGS Tested
   Price history chart & currency exchange rate

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