20g Solder Paste Flux Melting Point 183℃ Tin Soldering Paste for SMD BGA Reballing Mobile Phone PCB Repair

20g Solder Paste Flux Melting Point 183℃ Tin Soldering Paste for SMD BGA Reballing Mobile Phone PCB Repair
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sku: 4001222547058
$3.12+15%
$3.58
Shipping from: China
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