20g Solder Paste Flux Melting Point 183℃ Tin Soldering Paste for SMD BGA Reballing Mobile Phone PCB Repair

20g Solder Paste Flux Melting Point 183℃ Tin Soldering Paste for SMD BGA Reballing Mobile Phone PCB Repair
thumb
thumb
thumb
thumb
thumb
thumb
sku: 1005005437865171
$3.74
Shipping from: China
   Price history chart & currency exchange rate

Customers also viewed