wozniak 3D BGA Reball Stencil A8 A9 A10 A11A12 stencil tin plate for iPhone 6SPlus 7G X 8G 8P X XS XsMax series
Technical Details
| A8 A9 A10 A11 Solder tin plate: | Square hole net IC Chip BGA Reballing Stencil |
| Application: | Computer Tool Kit |
| BGA stencil: | telephone tool |
| Brand Name: | wozniak |
| DIY Supplies: | Electrical |
| D plant tin web: | 3D BGA Reball Stencil |
| d reballing stencil: | reballing stencils plate |
| For iPhone XS: | for iPhone X XS XsMax |
| Groove solder paste pringting steel sten: | Plant tin stencil |
| Heating Stencil reballin: | 3D BGA Reball Stenci |
| Model Number: | for iPhone |
| Package: | Case |
| plant tin: | Plant tin net |
| reballing: | 3d bga |
| Size: | 8*8*2 |
| stencil 3d iphone: | 3d bga for iphone |
| stencil bga: | bga reballing |
| Type: | 3D BGA Reball Stenci |
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