fanshao 50/150g SMT BGA Welding Lead-Free Rosin Flux Paste Solder Cream Repair Tool

Specifications: High bond strength PH value neutral insulation is strong welding surface smooth which is no corrosive for IC and PCB. Its boiling point just slightly higher than the melting point of the solder for mobile phones PC cards and other sophisticated electronic chip-level help welding. You can wipe the surface of the object before soldering apply the paste flux to the solder joint solder the tin to the solder joint with soldering iron. It can be widely used on BGA PC and flip chip operation suitable for phone circuit board repair. Instructions for Use: Before soldering clean the surface of the article. Apply this paste to the soldered copper tin iron and other metals. And then use the soldering iron to melt the tin at the welding place. Item Name: Flux Paste Material: Rosin Net Content: 50g 150g Feature: Lightweight Easy Cleaning Quick Welding Repair Tool Size Details: 50g: 5.6cm x 3.1cm x 3.1cm/2.2 x 1.22 x 1.22 (Approx.) 150g: 7.8cm x 7.3cm x 7.3cm/3.07 x 2.87 x 2.87 (Approx.) Notes: Due to the light and screen setting difference the item s color may be slightly different from the pictures. Please allow slight dimension difference due to different manual measurement. Package Includes: 1 Box of Flux Paste (Others Not Included)