YCS Tin Planting Pad Insulation Mat Universal BGA Stencil Magnetic Base For Mobile Phone CPU Chip Soldering BGA Reballing Tool

YCS Tin Planting Pad Insulation Mat Universal BGA Stencil Magnetic Base For Mobile Phone CPU Chip Soldering BGA Reballing Tool
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sku: 1005010628179207
$5.47
Shipping from: China
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