XZZ 28 IN 1 BGA Reballing Kit For iPhone X~16 Pro Max Motherboard Middle Layer IC Chip Rework Soldering Tin Template Tools

XZZ 28 IN 1 BGA Reballing Kit For iPhone X~16 Pro Max Motherboard Middle Layer IC Chip Rework Soldering Tin Template Tools
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sku: 1005008807700124
$6.00
Shipping from: China
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