WL 183C Intermediate temperature tin paste for iphone samsung huawei CPU NAND Baseband CHIP IC plant BGA Repair solder paste

WL 183C Intermediate temperature tin paste for iphone samsung huawei CPU NAND Baseband CHIP IC plant BGA Repair solder paste
sku: 32951304024
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$16.61
Shipping from: China
   Technical Details
Melting Point: 183 degrees
Model Number: WL-300
Particle Size: 25-48μm
Weight: 250g/500g
   Price history chart & currency exchange rate

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