W101 20Pcs Mobile Phone BGA IC Chip Repair Blades Kit CPU Repair Remover Blade Cutter Phone Motherboard Chip Repair Tool

Features This blade adopts imported Japanese full soft SK5 super thin silicon manganese alloy sheet which has heat resistance low temperature resistance oxidation resistance corrosion resistance good abrasion resistance and strong toughness It solves many problems such as inelasticity rust bending and so on Specifications Model W101Material Silicon Manganese Alloy Specification 200 x 145 x 15mm 7 87 x 5 71 x 0 59 Weight 265gProduct uses No 1 Dismantle all kinds of black glue small chips do not drop point No 2 Remove 6S power supply IC all kinds of glass IC do not hurt glass do not drop point no risk No 3 The CPU WIFI template with no risk will not drop No 4 Remove CPU upper level air no risk No 5 Remove all kinds of glass IC do not hurt the glass do not drop point no risk No 6 A4 A9CPU is not risk free There is no risk to remove all CPU No 7 Dismantle A8 A9 CPU No 8 Remove all kinds of chips scrape oil and scrape tin soft knife does not hurt tin point No 9 Scraping tin knife scraping baseband and other chips once and then without repeated repeated scraping No 10 Widening tin scraper scraping CPU once can not repeat repeated scraping Using method and principle first clean the edge glue of the lower knife position and the black glue around the chip when the chip is disassembled Packag Included 10 x IC Chip Repair Blades 10 x Handle Detail Pictures