Universal BGA Reballing Stencils 0.12mm for MSM8916 MSM8953 B01-AB C7 J3 J5 A5 for Samsung C7010 J610 CPU BGA Solder Template
sku: 32885615786
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$5.53
Shipping from: China
Technical Details
| Application: | Mobile phone repair tool |
| Brand Name: | NoEnName_Null |
| Compatible: | it is used for C7010 J610 MSM8916 MSM8953 B01-AB C7 J3 J5 A5 |
| DIY Supplies: | Electrical |
| Function: | Planting Tin tool |
| item name: | BGA Reballing Stencil |
| Model Number: | C7010 J610 CPU Reballing stencil |
| Package: | Bag |
| Size: | 0.12mm |
| Type: | BGA Reballing Stencil |
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