Universal BGA Reballing Stencil Kit 0.12mm Thickness Tin Mesh Solder Template for IP XSMAX XS XR X 8 8P 7P 7 6P 6 5 5S
Характеристики
Application: | For iPhone XR XSMAX XS Reballing repair |
Model Number: | WL BGA Reballing Stencil Kit |
Particle Size: | 1-10μm |
График изменения цены & курс обмена валют