Ultra Thin 0.01mm 0.02mm Insulated Non-insulated Copper Soldering Jump Wire for Mobile Computer PCB BGA Link Fly Line Welding

Ultra Thin 0.01mm 0.02mm Insulated Non-insulated Copper Soldering Jump Wire for Mobile Computer PCB BGA Link Fly Line Welding
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sku: 32980192624
$2.68
Shipping from: China
   Technical Details
Application: For BGA Cell Phone IC PCB Repair
diameter: 0.02mm/0.01mm
Flux Content: None
Material: Copper / Copper Alloy
Melting Point: Soldering Temperature should be Below 370 degrees
Model Number: A003
Weight: 4.5g
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