Tin Solder Paste XG-Z40 Solder Paste Flux Sn63 Pb37 25-45um with Syringe for Mobile Phone Computer Logic Board Soldering Repair
Technical Details
| Alloy: | Sn63/Pb37 |
| Application: | for Phone PCB BGA Soldering Tools |
| Brand Name: | MECHANIC |
| Color: | Colorless Transparent |
| Condition: | New, Unused |
| design: | Needle Tube |
| Drop ship: | Support |
| Features: | Sticky, Durable, Easy to Replace |
| Function: | for Phone Circuit Board SMT Welding |
| Insulated: | Yes |
| item name: | BGA Soldering Tin Cream |
| Material: | Soldering Paste Cream |
| Microns: | 25-45um |
| Model: | Dispenser Needle Solder |
| Model Number: | XG-Z40 |
| origin: | ShenZhen, China |
| Packing: | Bag |
| Particle Size: | 25-48μm |
| Product: | XG-Z40 |
| Shipping time: | Within 3 Days |
| Suitable for: | Phone, Computer Repair Industry |
| Supplier: | DIYPHONE |
| Type: | BGA Soldering Paste |
| Usage: | PCB BGA Repairing Tool |
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