S500 3D BGA Reballing Stencil CPU Logic Module BGA Reballing Repair Tool for iPhone 5 5S 6 6S 7G 7Plus 8 8P

Features: 3D laser square hole BGA reballing stencil template. High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient. New patented iphone X Middle Layer Motherboard for iPhone X Middle layer motherboard. Assisting professionals to do iPhone X BGA reballing in the most convenient and safest way. Specification: Type: A7 CPU / A8 CPU / A9 CPU / A10 CPU / A11 CPU Package included: 1 x BGA Reballing Tool Details pictures: