Relife Solder Paste RL-403 183C Sn63/Pb37

feature: 1. Good adhesion. The paste is fine and the particles are small only 20~38 microns. 2. Excellent wettability. After opening the surface remains wet for 36 hours. Does not affect welding. 3. Solder paste 183℃ melting point easy to solder easy to form 4. Unique formula perfect performance easy to weld bright and full no virtual welding virtual welding etc. Application: mobile phone chip repair computer and digital service industry high-precision circuit board SMT welding BGA welding process . The melting point of solder paste at room temperature is 183°C/molding which is fast and easy to solder Details: Viscosity: 160-dr230Pa Dimensions: 20-38um Merge point content model. RL-400 20g 183℃ RL-401 30g 183℃ RL-402 40g 183℃ RL-403 10cc183℃ Package includes: 1*Solder Paste 1* Needle 1*Booster