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RELIFE RL-044 Motherboard BGA Tin Planting Net Is Suitable For IP14 14Plus 14Pro 14MAX A16 Repair Reballing Stencil Solder Net
артикул: 1005004046665039
$4.42
182.00 грн.
+2%
~
186.00 грн.
$4.42, $1.00 = 42.00 грн.
418.00 руб.
+4%
~
435.00 руб.
$4.42, $1.00 = 98.40 руб.
€ 4.12
+3%
~
€ 4.24
$4.42, € 1.00 = $1.04
Доставка из: Китай
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77%
$3.71
RELIFE RL-044 Motherboard BGA Tin Planting Net Is Suitable For IP12 12PRO 12MAX 12MINI A14 Repair Reballing Stencil Solder Net
76%
$3.70
RELIFE RL-044 Motherboard BGA Tin Planting Net Is Suitable For IP12 12PRO 12MAX 12MINI A14 Repair Reballing Stencil Solder Net
69%
$4.97
RELIFE RL-044 IPZ13 A15 A16 BGA Reballing Stencil Template For iPhone 14 14Pro 14Plus 14ProMax Solder Tin Planting Net Tools
59%
$4.88
RELIFE RL-044 A15 16 CPU Planting Tin Steel Mesh For Phone 14 Series Motherboard BGA Repair Reballing Stencil Soldering Net
57%
$4.88
RELIFE RL-044 A15 A16 BGA Reballing Stencil for Phone 14 14Plus 14Pro 14ProMax CPU Integrated Tin Planting Steel Mesh
50%
$4.41
RELIFE RL-044 A14 CPU Tin Planting Stencil Motherboard BGA Reballing Stencil For IP 12/12Mini/12Pro/12 Pro Max/A14 Repair Tool
47%
$6.77
RELIFE RL-044 A14 CPU Tin Planting Stencil Motherboard BGA Reballing Stencil For IP 12/12Mini/12Pro/12 Pro Max/A14 Repair Tool
44%
$6.37
RELIFE RL-044 A14 CPU Tin Planting Stencil Motherboard BGA Reballing Stencil For IP 12/12Mini/12Pro/12 Pro Max/A14 Repair Tool
+2%
40%
$6.77
RELIFE RL-044 A14 CPU Tin Planting Stencil Motherboard BGA Reballing Stencil For IP 12/12Mini/12Pro/12 Pro Max/A14 Repair Tool
34%
$5.92
RELIFE RL-044 High Precision Steel Mesh CPU Baseband WI-FI NFC BGA Reballing Stencil Planting Tin Net For Iphone 7-13 Pro Max
31%
$6.61
RELIFE RL-044 A14 CPU Tin Planting Stencil Motherboard Stencil For IP 12/12Mini/12Pro/12 Pro Max/A14 Repair Tool BGA Reballing
28%
$6.30
A14 CPU Tin Planting Stencil RELIFE RL-044 Precision BGA Reballing Stencil For IP12 12PRO 12MAX 12MINI Motherboard Repair Tool
26%
$3.97
Amaoe CPU NAND Power Amplifier IC A15 A16 BGA Reballing Stencil For iPhone 14 Pro Max 14Pro 14ProMax 14Plus Tin Planting Net
19%
$5.80
RELIFE RL-044 For iPhone 14 Series BGA Reballing Stencils Set Protection Integrated Tin Planting Steel Stencil
16%
$4.88
RELIFE RL-044 IP14 BGA Reballing Stencil Kit for 14 Series Multi-purpose CPU Integrated Tin Planting Steel Mesh Solder Template
14%
$3.78
Reballing stencil RELIFE RL-044 A14 CPU Tin Planting Stencil Motherboard BGA For IP12 12PRO 12MAX 12MINI A14 Repair Tool
12%
$3.74
RELIFE RL-044 BGA Reballing Stencil Kit Thickness Tin Mesh Solder Template For IPhone 6 6S 7 8 X XS XR 1112 13 14/Pro/Max 15
10%
$4.83
RELIFE RL-044 BGA Reballing Stencils CPU Comprehensive Middle Layer Ball Planting Steel Mesh For 14 Series A15 A16 Chip Repair
8%
$3.50
RL-044 IP14 14P 14PRO 14PM BGA Reballing Stencils CPU Comprehensive Middle Layer Ball Planting Steel Mesh For Mobile Repair Tool
5%
$2.44
RELIFE RL-044 IPZ13 IP14/14Plus/14Pro/14ProMax-A15/16 CPU Integrated Tin Planting Steel Mesh Precise Alignment Half-cut Design
3%
$4.90
RELIFE RL-044 IP14 BGA Reballing Stencil Kit for 14 Series Multi-purpose CPU Integrated Tin Planting Steel Mesh Solder Template
1%
$4.23
RELIFE RL-044 BGA Reballing Stencil Kit Thickness Tin Mesh Solder Template For IPhone 6 6S 7 8 X XS XR 1112 13/Pro/Max/Mini
1%
$3.48
RELIFE RL-044 For Huawei OPPO VIVO XIAOMI PHONE BGA Stencil Reballing CPU RAM POWER PMIC Nand Flash IC Chip Solder Tin Plant Net
1%
$3.79
RELIFE RL-044 IP14/14Plus/14Pro/14ProMax-A15/16 CPU integrated tin planting steel mesh 0.12MM Precise alignment Half-cut design
1%
$4.27
RELIFE CPU NAND Power Amplifier IC A15 A16 BGA Reballing Stencil Kits Set For iPhone 14 Plus Pro Max 14Plus 14Pro 14ProMax
1%
$4.83
RELIFE CPU NAND Power Amplifier IC A15 A16 BGA Reballing Stencil Kits Set For iPhone 14 Pro Max Plus 14Pro 14ProMax 14Plus 14P
1%
$2.99
AMAOE 0.12mm BGA Reballing Stencil for Phone 14 14plus/Pro/Promax IP14 A15 A16 CPU Middle Layer Tin Planting Steel Mesh
1%
$4.94
RELIFE RL-044 For iPhone 14 Plus Pro Max A15 A16 CPU BGA Reballing Stencils Middle Layer Ball Planting Steel Mesh
1%
$4.27
Amaoe CPU NAND Power Amplifier IC A15 A16 BGA Reballing Stencil For iPhone 14 Pro Max 14Pro 14ProMax 14Plus 14P Tin Planting Net
1%
$12.63
RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity
О нас
Контакты
0.051, 4.52
8/.013,046 0=.000,089 1=.000,861/1 2=.000,690/1 3=.000,436/1 4=.000,820/1 5=.005,146/1 6=.000,108/1 7=.004,880/30 8=.000,105/1
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