RELIFE 183°C Solder Paste Sn63 No-Clean Lead-Free Medium Temperature Soldering Flux Paste Phone BGA Soldering repair
Technical Details
Apply: | BGA Solder Flux Paste |
Brand Name: | NoEnName_Null |
Factory: | RELIFE |
Feature: | No-clean Soldering Paste |
Function: | Sn63/Pb67 183°C |
Model: | RL-400 RL-401 RL-402 |
Model Number: | Solder Paste Flux |
Particle Size: | 20-38μm |
Use: | BGA Soldering Tin Cream |
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