Precision BGA Reballing Stencil Kit 0.12mm Thickness Tin Mesh Solder Template for Xiaomi Mi3 3S NOTE MI6 MIX2 RedMi NOTE

Precision BGA Reballing Stencil Kit 0.12mm Thickness Tin Mesh Solder Template for Xiaomi Mi3 3S NOTE MI6 MIX2 RedMi NOTE
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артикул: 33033711006
$4.98
Доставка из: Китай
   Характеристики
Application: For Xiaomi series
Model Number: WL BGA Reballing Stencil Kit
Particle Size: 1-10μm
   График изменения цены & курс обмена валют

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