Power IC BGA Reballing Stencil Template for Huawei Phone Repair for HI6555 HI6561 HI6553 HI6422 HI6421GFC HI6421 B HI6522 HI6551
sku: 32882901062
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$6.66
Shipping from: China
Technical Details
| Application: | BGA rework station accessory |
| Brand Name: | NoEnName_Null |
| Compatible: | For Huawei P7 CPU,Huawei P8 P9 Lite,Huawei MT8 P9 HI3650 |
| design: | with heat dissipating holes. |
| DIY Supplies: | Electrical |
| Function: | Reballing Assistant |
| item name: | BGA Reballing stencil template |
| Model Number: | Huawei Power IC Reballing stencil |
| Package: | Bag |
| Size: | New |
| Thickness: | 0.12mm |
| Type: | Reballing stencil |
Price history chart & currency exchange rate
