PHONEFIX Advanced OEM RMA-223 BGA Soldering Paste Flux+Syringe Plunger+Needle Head for Phone Chip PCB Welding 10CC No-clean Flux
Technical Details
| Adhesive Level: | High Viscosity |
| Advantage: | Good insulation avoid the pale yellow residue |
| Application: | for Phone PCB , BGA , PGA Reworking |
| Brand Name: | MECHANIC |
| Color: | Yellow |
| Dimension: | 93 x 33 x 23mm |
| diy type: | Solder Flux Paste |
| Drop Shipping: | Support |
| Features: | Mixture of High-quality Alloyed Powder |
| Flux Type: | RMA-223 |
| Function: | for Soldering, Reballing of Computer, Phone Chips |
| Insulated: | Yes |
| item name: | PCB BGA Solder Paste Flux |
| Length of Syringe Plunger: | 95mm |
| Lot: | 273-11-1 |
| Made in: | China |
| Material: | Alloyed Powder Resinic Pasty Flux |
| Model Number: | OEM RMA-223 |
| origin: | ShenZhen, China |
| Packing: | Bag |
| Particle Size: | 20-38μm |
| quantity: | One/Lots |
| Unit Type: | Piece |
| Usage: | Phone Chips Repair Tool |
| Volume: | 10CC |
| Weight: | 0.05KG |
| With Needle Tip: | Yes |
| With Syringe Plunger: | Yes |
Price history chart & currency exchange rate
