PHONEFIX 10/50g ZJ-18 Rosin Soldering Flux Paste Environmental for Phone BGA PCB Rework Station Welding Paste Flux Solder Ball
Technical Details
| Application: | for Phone/iPad PC BGA Unsoldering Repair Tool |
| Brand Name: | MECHANIC |
| Color: | As Picture Shows |
| Compatible: | for iPhone/iPad SMD Rework Station Repair |
| design: | Canned Rosing Soldering Paste |
| Features: | Transparent Residue, No Need to Wash |
| Function: | Multi-function for Smart Phone Electronic Soldering Repair |
| Granularity: | 1um |
| item name: | Solder Flux Rosin Paste for Phone PCB Board Welding |
| Material: | Rosin Soldering Paste |
| Model: | ZJ-18 Alloyed Powder Resinic Pasty Flux |
| Model Number: | ZJ-18 Solder Flux Paste |
| Net Weight: | 10/50g |
| Particle Size: | 1-10μm |
| Period of Dispatch: | Within 3 Days |
| Suitable for: | for iPhone PCB BGA IC Parts Welding Soldering Repair Tool |
| Supplier: | DIYPHONE |
| Type: | Mechanical Soldering Paste Flux |
| Usage: | for Phone Motherboard Soldering Flux Paste |
| Viscosity: | 1 Pa S |
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