PCB BGA SMD Lead-free Low Temperature SMT Melt Melting Point 138°C Solder Paste

Features: brand new high quality Made of high-quality materials for durability Essential materials for PCB board maintenance. Suitable for cardboard that cannot withstand high temperature or other special welding. Lead-free and environmentally friendly low melting point discontinuous tinning and no displacement. The stickiness is long-lasting easy to dry and the sticky time is more than 48 hours. Product parameters: Model: WNB 138℃ Flux Paste Composition: Sn42Bi58 Particles: 4um Material: solder paste material Capacity: 30g/50g/100g (optional) Wettability: Good wettability and high reliability. Function: It can effectively prevent printing collapse and preheating. Environmental performance: colorless and transparent does not affect detection excellent cleaning and cleaning performance. Storage: The product has strong wettability strong resistance to drying and has a long shelf life at room temperature. Package Included: 1 * Solder Paste Syringe (1 Solder Paste 1 Pin 1 Pusher) Note: 1.The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness. 2.Please allow slight manual measurement deviation for the data.